A full solution for coating semiconductor wafers with uniform thin films of photoresist in applications where traditional high speed spin coating cannot provide uniform coverage of deep well topographies or high aspect ratios such as MEMS. Designed for 100, 150, 200, and 300mm (option) semiconductor wafer processing.
Visit How Ultrasonic Nozzles Work to learn more about the unique capabilities of ultrasonic spray.
SPT WS wafer handler interiorSPT300 interiorSPT300 WS singleSPT300 WS dualSPT lift pinsSPT200 Ultrasonic Photoresist Coating System
Glass & Industrial
Semiconductor Wafers
Basic Specifications
| Enclosure Dimensions: 914mm W x 2093 mm H x 1246 mm D (36” W x 82” H x 49” D) |
| Work Area: 480 mm x 480 mm x 85 mm (18.9” x 18.9” x 3.3”) |
| Control: Windows-based (pc included 19-inch touch screen interface) |
| Power Requirements: 208-240VAC, 3A max, 50/60 Hz 1 phase (L,N,G) or (L1, L2, G) |
| Air: 0.68MPa (100PSI) 1 compressed air, 1 nitrogen |
| Motors: Brushless DC Servo |
| Certification: CE |
| Ultrasonic Nozzle Designs: Vortex, AccuMist, Impact |
| Photosensitive Lighting: 590nm UV safe |
| Drive Mechanism: Cleanroom rated enclosed ball screw drive |
System Options
| Heat and/or Vacuum Plate: Standard up to 150 degrees C |
| Head configuration: Up to two heads |
| Liquid Delivery: Common Liquid Delivery: Syringe pump (standard, Sonic or stirring), MicroFlow, SonoFlow Fusion |
| Heated wafer chuck (w/lift pins): 300 mm standard (100, 125, 150, and 200 mm options) |
