Sono-Tek provides wafer-level ultrasonic coating systems that replace traditional spin coating methods in the semiconductor industry—offering unmatched film uniformity, process control, and material efficiency for the photo-lithography process. Conventional spin coating often thins or fails along wafer steps, trenches, and wells, with uneven application of resist and dielectric materials. Sono-Tek’s precision ultrasonic spray process solves this limitation by depositing highly uniform, defect-free film coatings over complex wafer topographies and across a wide range of substrates, including silicon and ceramics.
Designed for cleanroom integration, Sono-Tek’s non-contact spray coaters deliver consistent, low-velocity atomized films with controllable thickness and superior adhesion. These coating systems are ideal for MEMS and photoresist deposition, polyimide dielectric layers, and protective films for wafer dicing—scaling from R&D to high-speed automated production.
By replacing spin coating, Sono-Tek’s ultrasonic coating technology achieves high uniformity, durability, and reduced chemical consumption, supporting the semiconductor industry’s drive toward higher yields, tighter critical dimensions, and more sustainable manufacturing.
MEMS / Photoresist
For MEMS devices and the photo-lithography process, Sono-Tek’s ultrasonic spray technology applies controllable, uniform photoresist films where spin coaters typically puddle, streak, or thin at steps and sidewalls. The process builds layers evenly across structured wafers, including deep wells and high-aspect features, maintaining film consistency that’s impossible to achieve with spin coating.
Using a high-frequency ultrasonic nozzle (typically 120 kHz or 180 kHz), the fine aerosol spray creates micro-droplets that gently settle onto the wafer surface, forming uniform, repeatable coatings. The ultrasonic vibration also de-agglomerates nanoparticles in the coating solution—preventing clumps and ensuring that each particle performs as designed within the resist or dielectric layer.
The result is superior coating thickness control, even along complex geometries, and consistent resist performance for MEMS and other wafer-level photo-lithography applications.
Polyimide
Sono-Tek’s ultrasonic coating systems apply pinhole-free polyimide dielectric films with tunable thickness from sub-micron to multi-micron ranges, delivering excellent step coverage and across-wafer high uniformity. The low-velocity spray process improves adhesion, material efficiency, and repeatability—essential for dielectric insulation layers in semiconductor wafer fabrication.
These solvent-compatible coating methods integrate seamlessly with cleanroom adhesion-promotion and curing workflows, providing durable, reliable dielectric performance for wafer-level packaging and interlayer insulation.
Protective Films for Dicing
Before wafer singulation, Sono-Tek’s ultrasonic coaters apply defect-minimized temporary protective films that shield wafer surfaces during dicing. The gentle, non-contact spray process produces even, adherent layers that prevent chipping, cracking, and particle contamination while supporting clean film removal and high downstream yield.
Ideal for silicon, ceramic, and compound wafers, these protective coatings improve durability and reduce surface damage—ensuring a stable, high-quality finish for semiconductor packaging lines.
Through advanced ultrasonic wafer-level coating technology, Sono-Tek partners with leading semiconductor manufacturers to achieve precise, uniform, and efficient film deposition for the photo-lithography process. From MEMS and dielectric coatings to dicing protection, Sono-Tek’s cleanroom-ready ultrasonic coaters deliver repeatable, high-performance results that redefine coating application standards across the semiconductor industry.
Sono-Tek’s ultrasonic semiconductor wafer coating systems provide a precise, scalable alternative to spin coating—allowing semiconductor manufacturers to apply ultra-uniform thin films, particularly photoresist, with a level of control and consistency unmatched by any other coating technology.