Company News

high aspect trenches

Sono-Tek will be exhibiting at The 27th IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2014) 2014 in San Francisco, CA on January 27, with Pragmatics Technologies, Booth #8. The expanding MEMs market is driving the need for uniform and precise deposition of photoresist into high aspect ratio trenches. Conventional spin photoresist techniques struggle…