Protective semicondutor wafer coatings for fragile structures such as MEMS and other microdevices, prior to dicing/handling.
Sono-Tek ultrasonic coating systems are commonly used to apply protective semiconductor wafer coating materials such as polymers, photoresist, dielectric materials and low viscosity adhesives, without damaging delicate structures.
The soft, low velocity ultrasonic spray provides gentle, uniform deposition of protective semicondutor wafer coatings without high speed acceleration of liquid associated with other coating techniques.
Sono-Tek has provided ultrasonic coating systems to glass manufacturers worldwide for over 2 decades, with no-drip, non-clogging, repeatable performance in 24/7 manufacturing lines.
SPT200 is an ideal system for coating of wafers, with features designed for easy wafer handling and processing.
Ultrasonic spray has been used for coating applications in the semiconductor industry for many years. This method offers significant advantages over spin coating and other deposition methods, and will not harm delicate components. Process benefits include:
- Single pass protective coating typical
- 2-75 micron thickness usually
- Polymers, photoresist, low viscosity adhesives and dielectric materials
- Large reduction of material usage compared to spin coating
- Excellent coverage with high topography delicate substrates